Case Studies


6SigmaET in the Industry


Used by industry leaders such as Motorola, Facebook, DELL, HP, Cisco, Lenovo, and Technicolor

Thermal simulation is a key element of the engineering design process. Our software enables you to create and solve models quickly, verify electronic designs before manufacturing, and optimize the best thermal performance while reducing your time to market. 6SigmaET enables you to spend more time on design, and less time on software operations.

LED Replacement Light Bulb


Improving Thermal Performance

ATS Europe created a thermal simulation of a LED replacement light bulb using 6SigmaET. The aim of the project was to develop a thermal management solution for the LED bulb without having to use a large heat sink. The form factor of bulb needed to be the same as a traditional light bulb. A thermal simulation was performed using 6SigmaET to verify the design. The predicted temperatures were within 5% of the experimental temperature measurements.

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LED Heat Sink Performance


Changing the Orientation

Optimal Thermal Solutions BV used the 6SigmaET simulation software to examine the effect of the orientation of an LED heatsink on thermal performance. The two heat sinks investigated included an extruded heat sink (ModuLED9980) and a pin fin heatsink (LPF11180-ZHE). The simulation results were compared with measured values, and the maximum difference between the test and simulation data was found to be 1.9 K or 5%.

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LED Down Lighter


Junction Temperature Analysis

ATS Europe have created a thermal simulation of an LED Down Lighter. The simulation was used to evaluate different configurations of the printed circuit board (PCB). 6SigmaET was able to predict LED junction temperature to within 5% of the experimental temperature measurements.

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Natural Convection LED Applications


Evaluation of Environment on Heat Sink Performance

Optimal Thermal Solutions BV used the 6SigmaET simulation software to investigate the effect that the environment has on the thermal performance of a LED heat sink. The performance of an LPF80A50 heat sink was examined in an open environment of UL6” format. The simulation results were compared with measured values, and the average difference between the test and simulation data was found to be 3.5%.

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ATS: LED Street Lamp


Optimization Through Internal Improvements

In order to identify suitable design changes which would improve thermal performance, ATS Europe used Future Facilities’ 6SigmaET simulation software to simulate the existing LED replacement street lamp. The results were verified against experimental data obtained. Design modifications were made to the lamp’s internal structure, with the outer casing unchanged. 

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Raspberry Pi 3 Case Study


Thermal Management of the Raspberry Pi 3

Soon after the launch of the Raspberry Pi 3 in February 2016 users started reporting overheating issues with the new version. The 6SigmaET team decided to investigate these reports through thermal simulation and measurements to provide some insight and advice on the best cooling strategies for users planning to operate the Pi 3 at maximum capacity.

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Rack Mounted Telecommunication Module


Forced convection

Alcatel Lucent created a thermal model of a rack mounted telecommunication module using 6SigmaET. The telecommunication module is high powered and is cooled by forced convection. The results of the thermal simulation have an excellent correlation with measured temperatures.

Ambient Temperature: 50 °C
Grid Cells: 17,680,294 
Solve time: 3h:48m
Temperature measured with thermocouples.

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Remote Radio Head


Robust. Rugged. Refined.

Alcatel Lucent created a thermal model of a telecommunication cabinet. The cabinet houses a range of different equipment with different cooling requirements. This means that the flow inside the cabinet is complex. The results of the thermal simulation have an excellent correlation with measured temperatures.

Ambient Temperature: 45 °C
Grid Cells: 19,564,803
Solve time: 5h:32m
Temperature measured with thermocouples

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Fine Pitch BGA 208


Approaching Reality at the Component Scale

Thales Global Services divisions has carried out thermal simulations of a complex electronic component at an unprecedented level of detail using 6SigmaET. In modelling the component, it has been possible to import all the copper tracks, for both the component and the board, in an STL format. This is all thanks to the powerful functionality of 6SigmaET. The thermal simulation was employed to create a compact RC network model that could be used in system level analysis.

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Telecommunication Cabinet


As much detail as you want

Alcatel Lucent created a thermal model of a telecommunication cabinet. The cabinet houses a range of different equipment with different cooling requirements. This means that the flow inside the cabinet is complex. The results of the thermal simulation have an excellent correlation with measured temperatures.

Ambient Temperature: 45 °C
Grid Cells: 19,564,803
Solve time: 5h:32m
Temperature measured with thermocouples

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  • 6SigmaET’s ability to import complex CAD files, coupled with its robust meshing and solving capabilities, significantly reduces our modeling time. We especially like the itemized results for heat distribution and the predefined thermal thresholds, which provide an easy snapshot of the simulation conditions.

    Saket Karajgikar
    Manager, Thermal Design Group at Hyve Solutions

  • Over and above thermo-fluid modeling, 6SigmaET's library feature affords access to a PDM-like database for simulation models, making them accessible and shareable across the enterprise. This capability increases efficiencies, and brings consistency and reproducibility to our processes. The suite of features is user friendly, easy to use, and provides good resolution and accuracy in modeling.

    Martin Pais
    Fellow & Director, Motorola

  • Thanks to 6SigmaET we were able to create simulated models of our soldering processes and now predict the behaviour of PCBs inside our manufacturing processes. The software proved to be the best market choice due to its ability to import all BOSCH PCB and product files, by its simulation speed and for its flexibility to adapt to different simulation environments.

    Miguel Peixoto
    Process Engineer, BOSCH

  • A comprehensive standalone tool, 6SigmaET doesn’t need additional MCAD software for data entry, which means it is especially straightforward to use. The software is fast, fits our thermal modeling needs perfectly, and experimental testing in our laboratories has proven that the simulation results predict component temperatures with accuracy.

    Norbert Engleberts
    Director, OTS

  • Using the quick and accurate thermal simulation features in 6SigmaET, we were able to cut our modeling time by 30%. The platform’s high-performance, cloud based solving allowed us to scale without hardware limitations, giving us the opportunity to double the number of projects we can take on.

    William Villers
    CTO & Director of Engineering, TEN TECH LLC

  • Whether building up a model from scratch or utilizing the simplicity of the software’s import capabilities for CAD and IDF data...modeling times are significantly reduced. This has helped in quickly turning around solutions during the design cycle to verify the equipment’s ability to withstand the harshest environmental conditions we know it will most probably encounter.

    Pablo Zicone
    Mechanical Engineer, SELEX ES